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TSMC announces plans to move to 32nm with high-k metal gates
Written by Andreas G 23 April 2008 19:09

The chip manufacturers are continuously improving their manufacturing processes and last week we reported about how IBM and partners had announced a new 32nm process using high-k metal gates. Competing foundry, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), has now announced that IBM isn't the only one who has plans for moving to 32nm using high-k metal gate technology, as it too will offer this process in the near future. The first advanced 32nm circuits are still far into the future though, but we should see the first working, although simple, 32nm chips at the beginning of 2009.

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Related news:
2008-11-18 TSMC mass producing 40nm chips
2008-09-29 TSMC unveils 32nm and 28nm plans
2008-09-01 IBM Project Quicksilver sports 4.1TB SSD and 1M I/O per second!
2008-05-06 Intel, Samsung and TSMC collaborate to make larger wafers
2008-04-17 IBM alliance announces 32nm high-k/metal gate process

 






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