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Revolutionary Design and Advanced Innovations to Deliver Ultimate Stability and Durability
Written by Andreas G 05 March 2009 20:44

Marine Cool is the name of a new motherboard concept from ASUS where it mixes military design with space technology. Even though that may bending the truth a bit, we do get a military feel from ASUS Marine Cools design concept where the big heatpipe construction together with a ceramic plate on the back to keep the temperatures at bay. The goal is to spread the heat across a larger surface and the out of the computer. The back also holds an integrated battery that acts like a UPS if the motherboard would lose power. When and in what form Marine Cool will appear is yet to be announced.

More in ASUS' press release;

Revolutionary Design and Advanced Innovations to Deliver Ultimate Stability and Durability

ASUS Marine Cool Concept Motherboard Utilizes Breakthrough Innovations in Materials-Ceramic and Metal-for Exceptional Cooling

ASUS, the world’s leading producer of motherboards, has unveiled its new Marine Cool concept motherboard. Eschewing traditional materials, this motherboard boasts a revolutionary technology—dubbed the Ceramic-Metal Thermal Module—that utilizes two different materials (ceramics and metals) to double cooling efficiency and thus allow it to work even in the most demanding of usage environments like high humidity and heat. Sporting a color scheme with gun-metal gray and metallic military-green highlights, together with a heatsink styled after a rugged military armored vehicle (symbolizing sturdiness and reliability), the overall design exudes a feeling of military-grade technology and reliability. Additionally, this motherboard features Onboard UPS—a built-in polymer battery for extra backup power and a server-standard Failover Memory design to help sustain system boot-up.

Aerospace-grade Thermal Dissipating Technology
The ASUS Marine Cool motherboard features a unique design that incorporates advanced thermal innovations in the utilization of ceramics and metals. On the front of the motherboard, a metal heatpipe module provides exceptional heat transference and dissipation for core components. Located on the back of the motherboard and set flush with the PCB, the Ceramic Backplate makes full use of a revolutionary micro-porous ceramic technology to provide a larger surface area—helping to effectively convey heat from the motherboard PCB and deliver highly effective heat dissipation. Together, this revolutionary thermal design is able to improve thermal efficiency by up to 2 times!

Ceramic-Metal Thermal Module

Onboard UPS for Sustained Power and Protection
The Marine Cool motherboard also features Onboard UPS—a built-in polymer battery that serves as an extra backup power supply that activates when a power failure is detected. This helps to avert damage dealt to onboard components, loss of critical files and data corruption due to inconsistent and fluctuating power caused during unexpected blackouts.

Marine Cool Onboard UPS (black)

Failover Memory
To provide even further support for operation sustainability, the server-standard Failover Memory design on the Marine Cool motherboard utilizes built-in memory to help continue system boot-up in the event of errors to add-on memory. When the PC is switched on, Failover Memory guarantees that the system will boot, regardless of incompatible or faulty memory.

Specifications are subject to change without prior notice. Please visit www.asus.com for more details.

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Related news:
2009-11-18 ASUS, Toshiba tops notebook reliability survey, HP last
2009-11-17 Accelero XTREME GTX Pro - Ultimate Cooling Weapon for Enthusiast-Grade Graphic Cards
2009-11-17 ASUS P7H57D-V EVO, Intel H57 board, pictures
2009-11-16 ASUS Maximus III Extreme - the new standard for overclockers?
2009-11-16 Asustek pondering buying Toshiba's notebook business

 






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