A-DATA has shared some of its plans for Computex and this includes showing its latest RAM modules of the XPG series. A-DATA's Xtreme Performance Gear family of memory modules will be expanded with the XGP Plus series that not only offers really high clock frequencies but also some extra features for keeping temperatures low. The PCB contains twice as much copper as usual to optimize cooling, but the memory also sport a new heatspreader with copper heatpipes for removing the heat.
More on A-DATA's new XPG memory modules below;
A-DATA Presenting it Latest XPG DRAM Modules with Superior Thermal Conductive Technology at Computex 2009
Taipei, Taiwan – May 25, 2009 - A-DATA Technology Co., Ltd., a worldwide leading manufacturer in high-performance DRAM modules and Flash application products, presenting its entire XPG™ - Xtreme Performance Gear product line and latest XPG Series DRAM modules with superior conductive technology in Nangang Exhibition Hall during Computex Taipei 2009.
As the success of presenting the leading XPG Xtreme series DDR3-2133X v2.0 DRAM module in the industry at CeBIT 2009, A-DATA presenting its XPG Plus Series v2.0 and Gaming Series v2.0 DRAM module with superior thermal conductive technology and characteristics heat sink design at Computex 2009.
XPG Plus Series version 2.0 DDR3-1866+ v2.0 CL8 DRAM Module
XPG Gaming Series version 2.0 DDR3-1600G v2.0 CL9 DRAM Module
Adopting new dual cooper heat pipe design, the XPG Plus Series v2.0 DRAM module offers offload heat with extreme efficiency to ensure superior stability and performance. Each memory chip is direct contact with a thermo-conductive copper heat pipe to perform heat away from the memory components, and dissipates it through the aluminum fin array. The XPG Gaming Series v2.0 DRAM module adopts additional surface area of heat sink to provide effective heat dissipation via effective heat sink design.
Moreover, both XPG Plus Series v2.0 and XPG Gaming Series v2.0 DRAM module come with doubling amount of copper of PCB (printed circuit board) to delivering low temperature and better power efficiency from critical areas of the DRAM module.
A-DATA is also presenting its new XPG SX94 2.5” SATA II SSD with RAID 0 array, available in 256GB and 512GB capacity, to deliver up to 230MB/sec and 160MB/sec read/write killer speed and reliability.
For more information about the latest XPG series products, please visit A-DATA booth at Computex 2009.
Date: June 2, 2009 - June 6, 2009
Place: Taipei World Trade Center Nangang Exhibition Hall (No.1, Jingmao 2nd Rd., Nangang District, Taipei City)
Booth No: J818, J824, J1017, J1023
About A-DATA
A-DATA is the world’s second largest vendor of memory modules (DRAMeXchange, May 2008), 2007 Taiwan Top 20 Global Brands as well as Emerging Brand (Interbrand, July 2007). The company’s main product lines include memory modules, Flash memory drives/cards, and multimedia application products. A-DATA’s corporate philosophy emphasizes constant innovation, first-rate quality and superior product performance; its innovative products have led the way in the memory industry. A-DATA products have won many major Taiwanese and international awards, including Germany’s iF Design Award and Reddot Award, Japan’s Good Design Award, TAITRA’s Best Choice Product Award, and Taiwan Excellence Gold Award. To find out more about A-DATA and its products, please visit the A-DATA website at www.adata-group.com and OC.adata.com.tw.
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A-DATA Presenting it Latest XPG DRAM Modules with Superior Thermal Conductive Technology at Computex 2009
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